HBM SIPI, Staff Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using Through Silicon Via (TSV) technology, we stack multiple DRAM chips with a high-speed interface die, significantly increasing memory density and bandwidth for next-generation AI/ML accelerators and high-performance computing platforms. Our designs target the industry's lowest power-per-bit and highest bandwidth, enabling the most demanding compute workloads.

We are seeking a SI/PI Engineer in HBM Build Architecture to develop high-quality SI/PI analysis for interposers, packages, and silicon channels. This work contributes directly to HBM build sign-off and product success. You will be involved in complex, multi-disciplinary SI/PI initiatives spanning multiple HBM product generations — from early interposer channel analysis and equalization co-design, PDN architecture, and system PI analysis. You will ensure Micron's HBM SI/PI architecture remains the industry benchmark for signal quality, power delivery integrity, and interface reliability. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.

Responsibilities will include, but are not limited to:

• Signal integrity channel analysis for 2.5D and 3D silicon interposer — including frequency-domain characterization (insertion loss, return loss, PSXT, IL-to-XT ratio) and time-domain analysis (eye diagram, BER, jitter decomposition)
• Conduct mask‑based timing analysis using time‑domain simulations (e.g., SPICE, ADS).
• Support power integrity and PDN analysis, including impedance modeling and transient response analysis.
• Electromagnetic extraction and modeling of signal and power delivery channels (PCB, Package, Interposers, etc.).
• Automate sign-off processes and work with EDA suppliers to improve tool accuracy and analysis flow.

Minimum qualifications

• 5 years of experience in signal integrity (SI) and power integrity (PI) modeling and analysis.
• Deep understanding of SI/PI, electromagnetic and transmission line theory, I/O design.
• Experience in circuit simulation such as Keysight ADS and Synopsys HSPICE.
• Use AI/ML/LLM for productivity or efficiency

Preferred qualifications

• 7+ years of experience in signal integrity and power delivery network (PDN) modeling and analysis.
• Experience in SI/PI modeling and analysis for 2.5D/3D advanced packaging (CoWoS, EMIB, interposer-based designs), including time-domain analysis (eye diagram, BER, jitter decomposition, PDN) and frequency-domain characterization (S-parameters, PDN impedance)
• Experience with mask-based timing budget and jitter analysis with time-domain simulation (SPICE, ADS, etc)
• Experience with high-speed interfaces such as DDR, HBM, UCIe, PCIe, and SERDES.
• Proficiency in simulation and analysis using industry-standard EDA tools, including ANSYS HFSS/SIwave, Keysight ADS, Synopsys HSPICE, Cadence PowerSI/PowerDC.

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

Additional compensation may include benefits, bonuses and equity.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

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