Summary written by USA Jobs 24 from Intel's advert and our data on 16,959 current US jobs. How we check every job
At a glance
Intel is hiring a NM Wafer Packaging Manufacturing Advanced Packaging Engineer in New Mexico. It is a full-time role in Hardware & Semiconductors, asking for at least 4 years of experience, first listed on November 6. The advertised pay is $103,730–$198,820 a year. The description mentions Statistics. Intel has 99 other openings in the US. Across all employers on USA Jobs 24 there are 279 Hardware & Chips openings in the US today; the typical one asks for 7 years and advertises about $187,000 a year at the midpoint.
How the pay compares
Intel advertises $103,730 to $198,820 a year, a midpoint of $151,275 a year. Where an offer lands in a range usually depends on experience and on the exact location. That is lower than about 80% of the 133 hardware & chips jobs across the US that publish a yearly rate on USA Jobs 24, where the typical midpoint is $187,000 a year. To see roughly what this leaves after federal and New Mexico tax, try our take-home pay calculator.
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Before you apply
- Check it is still open. We found this job on Intel's Workday site on November 6 and checked it again November 6, 5:17 AM ET. When an employer takes a job down, we remove it at our next daily update.
- Check the location works for you. This role is based in New Mexico. If you would need to move, ask whether relocation help is offered.
- Match the experience. The advert asks for at least 4 years of experience. If you are a little short, a close match on the skills in the advert can still win an interview.
- Tailor your resume. Use the advert's own words, such as Statistics, wherever they are true for you. Our resume guide shows how.
- Know your number. Decide the lowest offer you would accept before the first call. Our salary negotiation guide explains how to ask for more.
- Apply only through Intel's own site. Our Apply button goes straight to Intel's Workday page. If anyone contacts you about this job and asks for money, gift cards or bank details, stop and check it with our scam checker. Read how to spot a fake job offer.
About hiring at Intel
Intel has 100 openings on USA Jobs 24 today across 7 states. Most are in software & IT (45), hardware & chips (14) and operations (10). The biggest locations are Phoenix, AZ (38), Santa Clara, CA (28) and Austin, TX (7). None of them is fully remote, 23% are open to entry-level candidates and 100% show pay. We collect Intel's jobs every day straight from its own careers system (Workday), never from job boards or agencies.
The employer's advert
This is Intel's own description of the job, copied word for word from its careers site. We have not edited it.
Show the full advert from IntelHide the advert897 words
Job Details:
Job Description:
The Role and Impact
Note: This position requires regular onsite presence to perform essential job responsibilities.
New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will support both high-volume manufacturing (HVM) and technology development activities, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies.
Key Responsibilities
Responsibilities include, but are not limited to:
- Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency.
- Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance.
- Develop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones.
- Install, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones.
- Lead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence.
- Support and sustain development and pilot production lines during early test vehicle and production phases.
- Partner closely with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.
- Evaluate, qualify, and implement new hardware, software, and equipment upgrades.
- Lead critical task forces and cross-functional initiatives related to areas of ownership and adjacent manufacturing processes.
Desired Behavioral Traits
The successful candidate will demonstrate:
- A strong commitment to safety and a proactive approach to promoting a safe work environment.
- The ability to thrive in a dynamic environment with evolving priorities and technical challenges.
- A results-oriented mindset with strong organizational skills, initiative, resourcefulness, and accountability.
- Excellent analytical and problem-solving skills, with a strong sense of urgency and commitment to achieving business objectives.
- The ability to distill complex technical concepts into clear, actionable communication for stakeholders at all organizational levels.
- Proven success working within high-performing teams, including demonstrated leadership, collaboration, prioritization, and problem-solving capabilities.
- A continuous improvement mindset, with experience applying Lean principles and methodologies to drive operational and manufacturing excellence.
Qualifications:
Minimum Qualifications
- Bachelor's degree in a STEM or related engineering discipline with 4+ years of relevant semiconductor industry experience; or
- Master's degree in a STEM or related engineering discipline with 3+ years of relevant semiconductor industry experience; or
- PhD in a STEM or related engineering discipline with relevant academic or research experience in semiconductor technologies, electronics, mechanical engineering, manufacturing processes, or closely related fields.
Relevant experience may include:
- Semiconductor processing and manufacturing
- Process characterization and optimization
- Manufacturing process control methodologies
- Continuous process improvement initiatives
- Equipment maintenance and troubleshooting
- Design of Experiments (DOE) and data-driven problem solving
Applicable experience may be obtained through a combination of the areas listed above and does not need to be accumulated separately within each discipline.
For candidates qualifying through the PhD pathway, relevant academic research, laboratory work, publications, or dissertation projects may be considered in lieu of additional full-time industry experience.
Preferred Qualifications
- Hands-on experience in a semiconductor manufacturing environment, with a focus on process sustaining and/or process development.
- Knowledge of statistical analysis and experimental design methodologies, including their application to tool matching, tool qualification, and process optimization.
- Understanding of semiconductor process flows (logic and memory) and related metrology techniques and assessments.
- Proven project management skills, including experience leading cross-functional teams or task forces to solve complex technical challenges.
- Strong communication and collaboration skills, with the ability to work effectively across diverse teams, functions, and geographic regions.
Join us in shaping the future of semiconductor innovation. Apply now and become part of a team that is redefining the limits of technology through advanced manufacturing excellence. Minimum Qualifications
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, New Mexico, AlbuquerqueAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $103,730.00-198,820.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.USA Jobs 24 copied this listing from Intel's official careers site on November 6, 2026 and checked it again November 6, 5:17 AM ET. Intel will never ask you to pay to apply or to buy equipment with a check they send you. If anyone does, it is a scam.
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