Summary written by USA Jobs 24 from Broadcom's advert and our data on 16,852 current US jobs. How we check every job
At a glance
Broadcom is hiring a Staff AI Systems Thermal Engineer in San Jose, CA. It is a full-time role in Data, AI & Analytics, asking for at least 8 years of experience, first listed on November 12. The description mentions Embedded C, Python, MATLAB and CAD. Broadcom has 99 other openings in the US, 35 of them in San Jose, CA. Across all employers on USA Jobs 24 there are 65 Data & AI openings in San Jose, CA today; the typical one asks for 8 years and advertises about $235,000 a year at the midpoint.
How the pay compares
Broadcom has not published pay for this job, or we could not find it in the advert. Of the 814 data & AI jobs in California on USA Jobs 24, 73% show pay, and the typical yearly midpoint among them is $227,000. That gives you a fair starting point when the subject comes up. California has a pay transparency law that requires most employers to give a pay range for jobs there, so it is reasonable to ask the recruiter for it.
Skills in this advert
How often each skill named in this advert appears across the 1,860 data & AI jobs we list today. Python is the most widely requested (46% of jobs), while MATLAB is the least common (1%). Widely requested skills are what employers expect as a baseline; rarer ones show what is special about this job.
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Before you apply
- Check it is still open. We found this job on Broadcom's Workday site on November 12 and checked it again November 12, 5:17 AM ET. When an employer takes a job down, we remove it at our next daily update.
- Check the location works for you. This role is based in San Jose, CA. If you would need to move, ask whether relocation help is offered.
- Match the experience. The advert asks for at least 8 years of experience. If you are a little short, a close match on the skills in the advert can still win an interview.
- Tailor your resume. Use the advert's own words, such as Embedded C, Python and MATLAB, wherever they are true for you. Our resume guide shows how.
- Apply only through Broadcom's own site. Our Apply button goes straight to Broadcom's Workday page. If anyone contacts you about this job and asks for money, gift cards or bank details, stop and check it with our scam checker. Read how to spot a fake job offer.
About hiring at Broadcom
Broadcom has 100 openings on USA Jobs 24 today across 10 states. Most are in software & IT (45), hardware & chips (41) and product & design (3). The biggest locations are San Jose, CA (36), Fort Collins-, CO (26) and Plano, TX (10). 6% of them are remote, 1% are open to entry-level candidates and 2% show pay. We collect Broadcom's jobs every day straight from its own careers system (Workday), never from job boards or agencies.
The employer's advert
This is Broadcom's own description of the job, copied word for word from its careers site. We have not edited it.
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Job Description:
We are looking for an experienced AI Systems Thermal Engineer to lead the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip (D2C) liquid cooling solutions for next-generation AI accelerators and high-density compute platforms.
In this role, you will own the thermal-hydraulic performance of custom cold plates, interface materials, and fluid delivery subsystems—ensuring our high-power ASICs operate within safe thermal limits at peak workloads. You will collaborate closely with silicon package designers, board layout teams, mechanical housing engineers, and manufacturing partners from concept through mass production.
Key Responsibilities:
- Thermal & CFD Modeling: Build and run detailed Computational Fluid Dynamics (CFD) and thermal-resistance network models to evaluate temperature distribution, pressure drop, and flow balancing across cold plates, trays, and racks.
- Advanced Technology Implementation: Research advanced cooling technologies and develop integration and test plans to validate these technologies and convert them into production solutions.
- Cold Plate Design & Optimization: Co-design high-performance liquid cold plates with strategic industry partners to cool high-heat-flux AI processors.
- Thermal Interface Materials (TIM): Specify, select, and qualify thermal interface materials for large, high warpage, devices to minimize contact resistance between silicon dies and cold plates on large devices
- System & Hydraulic Integration: Design coolant flow paths, quick-disconnects (QDs), hoses, and cold-plate retention/loading mechanisms in alignment with server chassis and OCP (Open Compute Project) standards.
- Lab Validation & Testing: Plan and execute physical thermal testing in the lab—including thermocouple instrumentation, pressure/flow mapping, thermal test vehicle (TTV) bring-up, and simulation-to-test correlation.
- Cross-Functional Collaboration: Partner with mechanical, electrical, firmware (thermal control algorithms), and supply chain teams to drive PCBA, tray and system level designs from NPI (New Product Introduction) to high-volume manufacturing.
Qualifications & Requirements:
- Education: Bachelor’s or Master’s degree in Mechanical or Thermal Engineering (M.S. preferred), or equivalent.
- Experience: Bachelors plus 8+ years of experience, or Masters plus 6+ years of experience. Hands-on experience in thermal/mechanical design for high-power electronics, AI hardware, servers, or HPC systems.
- Proven, direct experience designing and deploying Direct Liquid Cooling (DLC) systems, specifically liquid cold plates, coolant distribution units (CDUs), and manifold loops.
Technical Skills:
- Electronics Cooling: Deep understanding of single-phase and/or two-phase heat transfer, fluid dynamics, pressure drop calculations, and electronics packaging interactions. Experience with air cooled systems also an asset.
- Simulation Tools: High proficiency in CFD and thermal analysis software (preferably Flotherm, FloEFD, and MacroFlow.).
- Lab Instrumentation: Experience with thermal data acquisition systems, flow meters, pressure transducers, and lab automation (Python, MATLAB, or LabVIEW).
- CAD & Mechanical Design: Experience with electronics packaging and CAD platforms, preferably CREO, an asset.
Compensation and Benefits
The annual base salary range for this position is USD To USD
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
USA Jobs 24 copied this listing from Broadcom's official careers site on November 12, 2026 and checked it again November 12, 5:17 AM ET. Broadcom will never ask you to pay to apply or to buy equipment with a check they send you. If anyone does, it is a scam.
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