Technical Integration Lead

Technical Integration Lead

Description -

Job Summary

HP is seeking an expert-level Technical Integration Lead to drive technical alignment and execution across programs development in MPD, with an initial focus on Specialty Printing & Technology Solutions (SPTS) programs. This role connects technology development, product development, and commercialization by ensuring that requirements, interfaces, technical dependencies, and integration plans are aligned across the portfolio.

The Technical Integration Lead serves as a technical authority for complex, multidisciplinary integration challenges spanning printheads, inks and supplies, mechanical and electrical systems, firmware, software, manufacturing processes, and OEM partner solutions, as applicable. Working across engineering, program management, operations, quality, and partner teams, this individual guides decisions that balance performance, reliability, cost, schedule, and customer needs.

The successful candidate combines deep technical expertise with systems thinking, sound judgment, and the ability to influence across organizational boundaries. This role operates with broad autonomy and provides technical leadership and mentorship across multiple programs.

Key Responsibilities

• Lead technology development and feasibility during program definition. Partner with business and technical teams to assess technology readiness, validate concepts, and identify integration risks. Guide feasibility studies and early development work to inform program scope, requirements, architecture, and investment decisions.

• Lead integration across programs. Establish a coordinated technical integration approach that connects program objectives, shared technologies, platform capabilities, and product roadmaps.

• Align business and technical priorities. Collaborate with business leaders, product management, and technical teams to translate strategy, customer needs, and portfolio roadmaps into agreed requirements, interfaces, and acceptance criteria; communicate key tradeoffs and maintain traceability through verification and validation.

• Manage technical dependencies. Identify dependencies among programs, shared components, development teams, suppliers, and OEM partners. Align integration milestones and resolve conflicts affecting delivery.

• Guide architecture and technical decisions. Lead cross-functional tradeoff assessments and recommend solutions that balance customer value, technical feasibility, quality, cost, and schedule.

• Drive integration readiness. Define integration sequences, test strategies, and technical readiness assessments with engineering and program teams.

• Resolve complex technical issues. Lead structured investigations of system-level failures and cross-disciplinary problems. Coordinate root-cause analysis, corrective actions, and verification of resolution.

• Enable reuse and scalability. Identify opportunities to standardize interfaces, reuse proven technologies, and establish common integration methods across SPTS programs.

• Support lifecycle execution. Partner with development, manufacturing, supply chain, quality, and SPTS to address integration needs from early feasibility through launch, sustaining, and product transitions.

• Communicate technical risk and readiness. Present clear assessments, options, and recommendations to program teams and leadership. Escalate unresolved issues with defined impacts and proposed actions.

• Strengthen technical capability. Mentor engineers and technical leads, facilitate technical reviews, and incorporate lessons learned into future programs.

Education and Experience

• Bachelor’s degree in engineering or materials science.

• Typically 10 or more years of relevant experience in systems engineering, product development, technical integration, or technical leadership.

• Demonstrated experience leading complex integration efforts across multiple programs or multidisciplinary development teams.

• Proven success delivering products or technologies through development, qualification, and production readiness.

Required Knowledge and Skills

• Expert knowledge of systems integration, requirements management, interface control, verification and validation, and technical risk management.

• Deep expertise in at least one relevant engineering discipline, with the ability to evaluate interactions across designs, materials, inks and manufacturing.

• Strong analytical and experimental problem-solving skills, including root-cause analysis and evidence-based decision-making.

• Ability to translate ambiguous business and customer needs into actionable technical requirements and integration plans.

• Demonstrated ability to influence decisions and secure commitments without direct reporting authority.

• Strong communication skills, including the ability to explain complex technical issues and tradeoffs to engineering and business audiences.

• Ability to manage competing priorities and make sound decisions with incomplete information.

Preferred Qualifications

• Experience with thermal inkjet technology, printheads, ink delivery systems, writing systems, inks or industrial printing applications.

• Experience integrating technologies into OEM products or supporting external development partners.

• Familiarity with platform development, product families, and shared technology roadmaps.

• Experience with reliability engineering, design for manufacturability, qualification, and production ramp.

Measures of Success

• Programs achieve agreed integration milestones and technical acceptance criteria.

• Critical dependencies and interface risks are identified and resolved early.

• Integration defects, late design changes, and repeated technical issues decrease.

• Shared technologies and interfaces support effective reuse across programs.

• Engineering, operations, and partner teams have a clear, consistent understanding of technical readiness.

The pay range for this role is $116,150 to $182,400 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Not Specified

Relocation -

Yes

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"