IC packaging layout manager

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

The package engineering team drives semiconductor package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design that results in the delivery of engineering samples and a subsequent production ramp-up. There is the excitement of always working on new projects and cutting-edge technologies.

What You Can Expect

The Manager will be responsible for managing the team that is involved in IC packaging layout for high speed 2D and 2.5D packages across multiple product lines. The manager will develop the team to do IC package layout considering manufacturing and assembly tolerances.

What We're Looking For

Bachelor’s degree in computer science, Electrical Engineering or related fields and 8+ years of related professional experience.

Master’s degree and/or PhD in Computer Science, Electrical Engineering, or related fields with 8-10 years of experience.

• Experience managing high-performance technical teams
• Strong expertise with IC package layout tools, such as Cadence APD or Mentor XPD
• Ability to manage resources for IC package layouts across multiple product lines
• Experience with 2.5D package design for IC packaging technologies such as CoWOS
• Experience with IC package layout for high-speed SerDes interfaces, such as 224 Gbps
• Experience with IC package layout for die-to-die and HBM interfaces in 2D and 2.5D RDL interposers
• Proven track record of new product introduction, from concept through development and production
• Understanding of IC package design requirements for high-speed interfaces, including setting up the constraint manager
• Ability to automate layout tasks using scripting and AI methodologies
• Strong understanding of the Design for Manufacturing (DFM) process
• Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules
• Experience with power plane design and translating power supply requirements into design
• Experience working with external IC package layout vendors
• Ability to look after the well-being of the team and ensure it performs efficiently
• Strong communication, presentation, and documentation skills

Expected Base Pay Range (USD)

149,340 - 223,700, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.


This role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success.


Additional Compensation and Benefit Elements

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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